elSoM-3CG
Heterogeneous Multiprocessing System on Modules for Broad Range of Embedded Applications
elSoM-3CG is enabled with a multiprocessor system on a chip that includes microprocessors. As such, it is a multi-core system-on-chip. The elSoM-3CG is a powerful System on Module provides the advantage of the processing unit with real time parallel processing power of FPGA. This economic module, with its small form factor and a user-friendly embedded development board will help get any kind of application running smoothly, in no time. elSoM–3CG is Powerful and compact (60mmX50mm) in size. The board-to-board High speed connectors from SAMTEC will expose 143 pins to development board (elDB-3CG)

Key Features
The elSoM-3CG contains Dual-core Arm Cortex-A53 MP Core Application processing unit and Dual-core Arm Cortex-R5F MP Core Real time processing unit. Rich peripherals PCIe® Gen2, USB 3.0, SATA 3.1, DisplayPort and Gigabit Ethernet makes this SoM suitable for many embedded applications.
Zynq UltraScale+ EG FPGA
Dual Arm Cortex-A53 & R5F
16nm FinFET+ Programmable Logic
Power efficient and small factor

Zynq UltraScale+ CG FPGA
Processor Memory
Program logic memory
Gigabit Ethernet phy
elSoM-3CG Specifications
Processor
Application Processing Unit
Quad-core Arm® Cortex®-A53 MPCore™ up to 1.5GHz
Real-Time
Dual-Core Arm Cortex-R5F MPCore up to 533MHz
Memory
LPDDR4/4X (PS Side)
Supports up to 16GB
DDR4 (PL Side)
Supports up to 8 GB
eMMC 5.1
32GB/64GB
SD card (SD2.0 SD3.0)
Supports up to 32GB
QSPI Flash Memory
256MB / 512MB / 1024MB in Dual Parallel-Mode
Check Out All the System Compatibility
elSoM-3CG Specifications
Processor
Application Processing Unit
Quad-core Arm® Cortex®-A53 MPCore™ up to 1.5GHz
Real-Time Processing Unit
Dual-core Arm Cortex-R5F MPCore™ up to 600MHz
Programmable Logic
System Logic Cell (K)
256
Memory (MB)
23.1
DSP Slices
1248
Maximum I/O Pins
252
Memory
LPDDR4/4X (PS Side)
Supports up to 16GB
DDR4 (PL Side)
Supports up to 8GB
eMMC 5.1
32GB/64GB
SD Card (SD2.0 SD3.0)
Supports up to 32GB
QSPI Flash Memory
256MB / 512MB / 1024MB in Dual Parallel-Mode
Networking
Ethernet
1x10/100/1000Mbps RGMII
Connectivity
High-Speed
PCIe® Gen2 X4, 2x USB3.0, SATA 3.1, DisplayPort, 4x Tri-Mode Gigabit Ethernet
General
2xUSB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO
Input Voltage
Supply Voltage (V)
48V POE
Environmental
Operating Temp ( °C)
0 °C To +100 °C (Extended)
Operating Temp ( °C)
-40 °C To +100 °C (Industrial)
Storage Temp ( °C)
-40 °C To +100 °C
Storage Humidity
5% To 95%
Mechanical
Dimensions (WxL) mm
60 x 50 mm
Software
OS Support
Peta Linux
RTOS (on Demand)
Downloads
Where do we fit in?
Check this list of segments out of the countless sectors under that elSoM-3CG helps improving build Applications

Secure Solutions

Medical Endoscopy

Cloud Security

Data Center

Machine Vision

Missile & Munitions

Flight Navigation

Military Production
We have partnered to develop Heterogeneous Multiprocessing SoM for Embedded Applications
ELDAAS has partnered with Xilinx with the aim of developing Heterogeneous Multiprocessing System on Modules for the Market


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We are delighted to partner with Eldaas and congratulate on launch of elSoM-5CG & elSoM-3CG based on Xilinx Platform. One of the first companies in India to become the Xilinx system partner and hopeful that the domestic market will leverage on their expertise for innovative products and solutions. We wish them success on this new business initiative and look forward to continued partnership with more Xilinx offering.
Team Xilinx India Xilinx India